Copper Clad Laminate (Circuit Board Materials)
Complex series of all kind of Copper Clad Laminate (CCL) which is based material for circuit board. Including XPC, FR-1, CEM-3, FR-4, and Flexible Circuit Board.

Aluminum and Metal - Copper Clad Laminate (CCL)

Aluminum and Metal - Copper Clad Laminate (CCL)

CEM-3 - Copper Clad Laminate (Circuit Board Materials)

CEM-3
- Glass composite circuit board materials for digital electronic appliances
- Excellent tracking resistance, Industry’s highest level of tracking resistance
- Excellent thickness accuracy
- Inorganic resin circuit boards which realize an excellent process-ability and design flexibility as well as an excellent cost performance

FR-1 - Copper Clad Laminate (Circuit Board Materials)

FR-1 (Paper Phenolic Copper Clad Laminate)
- 94V-0 (UL Recognized Class Frame)
- Superior low temperature punching
- Small and stable Dimensional change and warpage
- High Tracking Resistance, High Heat Resistance

FR-4 - Copper Clad Laminate (Circuit Board Materials)

FR-4
- High reliability halogen-free multi-layer circuit boards materials
- High Speed, Low Loss Multi-layer Materials

Flexible Circuit Boards

Flexible Circuit Boards
- Excellent Dimensional Stability
- Excels in high frequency characteristics and low transmission loss after moisture absorption
- Excellent Spring back performance and High flexibility

XPC - Copper Clad Laminate (Circuit Board Materials)

XPC
- Superior low temperature punching
- Small and stable Dimensional change and warpage

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